This reduces the effective distance between the plates.
Introduction Types Monopole Bipolar Tripole Multi-polar Materials Anodized Aluminum Aluminum Nitride Polyimide Ceramic Flame spray Johnsen-Rahbek Issues Clamping Thermal Characteristics RF Effects Trouble-shooting Goals Electrostatic clamping is widely used on single substrate process equipment in the semiconductor industry.
In this article we will discuss the different configurations, materials, and troubleshooting of Electrostatic chucks "ESC's".
The phasing of the voltage applied to the electrode permits "rapid clamping and release".
The supply and control circuitry required for this type of ESC is more complicated than the monopole, bipolar or Tripole configurations.
The substrate will be securely clamped to the dielectric when there is a return path for the ESC power supply.
The normal mode of operation for a monopole ESC is for the electrode to be connected to the negative pole of the power supply.
The outer pole can be used as either a plasma shield or a substrate bias pickup point.
Multi-pole Multi-pole ESC's use either AC or DC that is phased to each pole of the electrode.
The ESC can then be cycled to a lower voltage for substrate processing.